Cirtek taps US tech giant for development of 5G
Iris Gonzales (The Philippine Star) - July 21, 2019 - 12:00am

MANILA, Philippines — Cirtek Electronics Corp. (CEC) has bagged a multi-million dollar deal with a US-based technology giant to help manufacture 5G wireless systems.

CEC is a wholly owned subsidiary of Cirtek Holdings Philippines Corp.

The US company is based in Silicon Valley and it specializes in telecommunications e-band ceramic modules and chipsets.

“The 5G products, which will be used for data traffic control and for high bandwidth, high speed transmitters, are expected to generate revenues to Cirtek of up to $3 million per year starting 2020,” Cirtek said.

As part of the deal,  the US based company will transfer its assembly, pre-cap test and RF final test line from the US into CEC’s facility and will consign assembly and RF test equipment to CEC.

CEC, in turn will invest and upgrade its surface mount technology, or electronic board assembly, capabilities and capacity.

This developed as Cirtek Advanced Technology and Solutions Inc. (CATSI), also a wholly owned subsidiary of CHPC, will expand its RF board Module Assembly manufacturing business in 2019.

This will translate to $4 million revenue or a 33 percent increase year-on-year.

A major customer is consolidating its business and aims to capitalize on CATSI’s vast experience in RF, microwave, and millimeter wave manufacturing.

CATSI provides high quality, cost efficient and reliable solutions for communication systems and wireless infrastructure equipment.

“These new business developments highlight the Cirtek Group’s continuing capability to deliver relevant, complex, full turnkey solutions, to the benefit of our customers,” Cirtek said.

Through its subsidiaries, CHPC designs, produces and delivers station antenna systems for wireless communication.

It also  manufactures solutions for value-added, highly integrated radio frequency (RF), microwave and millimeterwave technology products, and provides full service/turnkey solutions including wafer probing, wafer back grinding, assembly, packaging and final testing of semiconductor devices.

CHPC, through its subsidiaries harnesses, more than 55 years of combined operating track record.

In all, the company’s products cover a wide range of applications and industries, including communications, consumer electronics, power devices, computing, automotive and industrial.

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